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Remove Flux residues from printed circuit boards
7/32" x 1/4"
Assortment of router bits with T
Superior Chemical Resistance with 140+ ratings on chemicals
High-medium-low leak sensitivity selector
Chip Quik SAC305 No-Clean T3 Solder Paste Lead-Free 250g Jar vendor_KASP Remove Flux residues from printedOverview Solder Paste in jar 250g (T3) SAC305 no clean 88. 5% metal. Specifications Alloy Sn96. 5 Ag3. 0 Cu0. 5 Flux Type Synthetic No Clean Flux Classification REL0 Metal Content 88. 5% metal by weight Particle Size T3 (25 45 microns) Melting Point 217 220C (423 428F) Size 250g Jar Stencil Life >8 hours @ 20 50% RH 22 28C (72 82F) >4 hours @ 50 70% RH 22 28C (72 82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted
US$ 199.99
US$ 140.00
